Although Hisense is not a renowned brand for the production of smartphones, the company has shown that it can do it in past years. We recall in fact some devices such as the Hisense King Kong 6 with a huge 10000mAh battery (thanks to the cover) and other smartphones equipped with e-ink screens such as the Hisense A5.
Hisense F50 5G coming soon with UNISOC chip
Well, the model anticipated today, the Hisense F50 5G, seems to have support for 5G connectivity as the flagship. But the peculiarity is that this support would be brought by a chip of a manufacturer that we do not often hear about, it is in fact UNISOC.
The chipset in question would be the Unisoc T7510 which uses the Chun Teng V510 baseband developed internally by the Ziguang Zhan Rui company. This technology was first introduced at MWC 2019 and supports sub 6GHz 5G bands with bandwidth up to 100MHz.
The rest of the chipset uses standard components including an octa-core CPU with 4x Cortex-A75 at 2,0 GHz and 4x A55 at 1,8 GHz. To these are added an Imagination PowerVR GM9446 GPU and a dual-core NPU (of unknown origin). Local connectivity supported by the chipset includes Wi-Fi 5 (ac) and Bluetooth 5.0.
Returning to the Hisense F50 5G, the smartphone will adopt a large 5010mAh battery with support for 18W fast charging and "PC" cooling. We also see a total of four rear cameras and a fingerprint sensor in the central pate of the cover.
The smartphone will be made official on Monday 20 April.