Qualcomm not only focuses on smartphone processors but also for chips of other genres. During the Mobile World Congress 2022 the US company presented three products. One of them is a very high speed 5G modem and the other two are gods chips for audio devices. In the first case it is a real revolution since we are talking about the world's first 5G chip with integrated AI. Here's everything you need to know.
Qualcomm introduces the Snapdragon X70, the world's first 5G AI chip and two audio chips featuring Bluetooth 5.3 technology. Here are all the details
Qualcomm's portfolio has been beefed up with a new high-speed 5G modem Snapdragon X70, which for the first time in its history it has acquired its own artificial intelligence. In addition, the company showed other new chips for the audio systems of mobile devices and equipment with support for the standard Wi-Fi 7.
According to Qualcomm, the Snapdragon X70 modem is the world's first 5G native AI chip capable of high speed connections (up to 10 Gbps downlink and up to 3.5 Gbps uplink) on all commercial bands (600 MHz to 41 GHz). The main task of artificial intelligence as part of the modem is optimize the quality of communication reducing delays, including scanning the surrounding network.
Speaking of performance, the company claims the modem has become the 60% more efficient from an energy point of view compared to its predecessor and is able to increase the autonomy of 5G smartphones using AI. Also, it uses the 5G PowerSave technology owner of Qualcomm, third generation. It is expected that the modem will appear along with the processor Snapdragon 8 Gen2.
In addition, the chip maker has introduced the wireless system FastConnect 7800 with up to 5.8 Gb / s bandwidth for Wi-Fi 7 enabled equipment. According to the specs, thanks to 4K QAM modulation and the use of a 320 MHz channel, the mating speed and range of coverage will double compared to the previous generation of chips.
Finally, the company showed the new sound chips called QCC5171 e QCC3071. They support the adaptive codec aptX, Qualcomm cVc echo cancellation and active noise cancellation. The new chips are compatible with the Bluetooth LE Audio standard, specifically Bluetooth 5.3: the energy consumption, in fact, is 20% lower than their predecessors. Another feature of the new products is the low latency: only 68 ms.
