When we talk about Qualcomm we almost always think of smartphone processors but in reality the American company has much more in the catalog. The chipsets it produces are inside headphones, Bluetooth speakers and many other products. But it's not just about microprocessors. In fact today, during the CES 2021, presented his new ultrasonic fingerprint reader called 3D Sonic Sensor Gen 2. Let's go see all the details together.
Qualcomm's new ultrasonic fingerprint reader is called 3D Sonic Sensor Gen 2: more efficiency and speed
In general the technology offers one larger surface area of the sensor and faster processing to unlock smartphones even faster. Let's see some numbers: the sensor Qualcomm 3D Sonic Sensor Gen 2 measures well 8 x 8 mm compared to the 4 x 9 mm surface of the first generation model. This is the 77% more usable surface. However, this is not necessarily a malus, on the contrary: the largest surface allows greater accuracy. However, the more space a smartphone uses, the smaller the battery and other components become. But also here do not worry: the thickness of the sensor reaches only 0.2 mm
By combining the larger sensor with faster processing, Qualcomm promises that fingerprint scanning will be faster than 50%. In more technical terms this new ultrasonic fingerprint sensor allows you to capture up to 1.7 times more biometric data.
All nice, but when will it be integrated in the first smartphones? The company has not gone too far but it is expected that the first devices to use the new generation unlock sensor will be the flagship of the first months of 2021. It is not clear if already OnePlus 9 and the various flagships that follow will be equipped with it. The announcement has just taken place but it is possible that the company has already supplied the material to OEMs.
It is worth mentioning that this is the third fingerprint sensor of the US company: before him we find in fact 3D Sonic Sensor e 3D Sonic Max (the latter presented in 2019 with the Snapdragon 865).