Today the official account of the Red Magic Game Phone on Weibo announced that the presentation of the Red Magic 28S gaming phone and other smart products belonging to the Red Magic ecosystem will be held on May 5.
Red Magic 5S: We now know the presentation date
As with previous generations, the Red Magic 5S focuses on heat dissipation. In fact, also this time the heat dissipation has been enhanced again, using for the first time a silver alloy with the highest thermal conductivity in the world.
Ni Fei, president of ZTE's Terminal Business Unit, anticipated the perfect combination of ICE Ag and a large 4843mm² copper foil to efficiently conduct heat outside, combined with a high performance centrifugal fan from Built-in 15000 rpm and a transparent design from above to below. In addition, a number of combinations of air ducts, high performance thermal gel and super large liquid cooling pipes will further improve the heat dissipation efficiency.
If the internal dissipation system is not enough here, the Red Magic 5S will also arrive with a box that covers the device and connects to the internal ICE Ag heatsink.
as for the other specifications, the Red Magic 5S will arrive with a Snapdragon 865, LPDDR5 RAM memory and UFS 3.1 flash memory.
